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2019•Unpublished venueRequires access

Research on Applied Reliability of BGA Solder Balls in Extreme Marine Environment

Liyuan Liu, Tao Lü, Daojun Luo, Hui Xiao

Open publisher page 2 citations

Abstract

The paper simulates the pressure of extreme marine environment, carries out pressure test on BGA devices, studies the changes and trends of BGA solder joints before and after test, analyses the reliability changes and the potential risks. The model of BGA solder joints is established by means of finite element modeling, and the influence of the position and size of voids in BGA solder joints after reflow soldering in pressure test is studied. Therefore, the preventive inspection measures for the corresponding reliability risk of BGA solder joints are put forward, which provides reliability assurance advice for BGA solder joints exposed to extreme marine environment.

About this research paper

What this paper is about

The paper simulates the pressure of extreme marine environment, carries out pressure test on BGA devices, studies the changes and trends of BGA solder joints before and after test, analyses the reliability changes and the potential risks. The model of BGA solder joints is established by means of finite element modeling, and the influence of the position and size of voids in BGA solder joints after reflow soldering in pressure test is studied. Therefore, the preventive inspection measures for the corresponding reliability risk of BGA solder joints are put forward, which provides reliability assurance advice for BGA solder joints exposed to extreme marine environment.

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OpenAlex reports 2 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Method / approach

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Available abstract

The paper simulates the pressure of extreme marine environment, carries out pressure test on BGA devices, studies the changes and trends of BGA solder joints before and after test, analyses the reliability changes and the potential risks. The model of BGA solder joints is established by means of finite element modeling, and the influence of the position and size of voids in BGA solder joints after reflow soldering in pressure test is studied. Therefore, the preventive inspection measures for the corresponding reliability risk of BGA solder joints are put forward, which provides reliability assurance advice for BGA solder joints exposed to extreme marine environment.

Key concepts: Ball grid array, Soldering, Reliability (semiconductor), Materials science, Reliability engineering, Metallurgy, Engineering, Quantum mechanics

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