Contributions on low-cost /spl mu/BGA soldering/re-soldering methods

The /spl mu/BGA soldering process is usually performed in special soldering equipment, under extreme conditions of humidity and temperature. The re-working process of such devices is not recommended due to the complex equipment needed for de-soldering and re-soldering of /spl mu/BGA capsules. However, the rapid prototyping process of electronic modules sometimes calls for some "home-made" methods to re-work the /spl mu/BGA capsules. The paper proposes a low-cost solution for /spl mu/BGA soldering/re-soldering process by using mostly common tools for re-working. The main topics covered by the paper are: balls array growth/re-growth process, hand soldering/re-soldering of /spl mu/BGA capsules, tips on oven soldering/re-soldering of /spl mu/BGA modules, testing the /spl mu/BGA soldering and humidity cautions on /spl mu/BGA soldering. The paper also proposes a new method of calibration for the soldering temperature of a small oven.