2012•Electronics Process TechnologyRequires access

Solder Cavity Problems of BGA under Mixing Assembly

Wen Dahua

Abstract

Elaborate solder cavity problems of BGA under mixing assembly in practice.Introduce the common soldering methods for BGA under mixing assembly and analyze their advantages and disadvantages.Represent the inspection standards of BGA solder cavity.Analyze the reason of lead-free BGA solder cavity through comparing solder joint of lead BGA and lead-free BGA.Put forward the measures to prevent BGA solder cavity.

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Available abstract

Key concepts: Ball grid array, Soldering, Mixing (physics), Materials science, Joint (building), Metallurgy, Structural engineering, Engineering