Shi Bao-song
Abstract
Introduce a general method of the BGA soldering and analyze the reasons of the voids of BGA soldering.Focus on high reliability applications,a low temperature assembly process which reduces effectively voids of BGA soldering has been described in detail.Analyze the reliability of BGA solder joints soldered by this method.
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Introduce a general method of the BGA soldering and analyze the reasons of the voids of BGA soldering.Focus on high reliability applications,a low temperature assembly process which reduces effectively voids of BGA soldering has been described in detail.Analyze the reliability of BGA solder joints soldered by this method.
Key concepts: Ball grid array, Soldering, Dip soldering, Materials science, Reliability (semiconductor), Process (computing), Wave soldering, Metallurgy