Random vibration analysis of BGA with different size of the SAC0307 solder joint

In the paper, the mechanical properties of BAG package structure under random vibration load are studied based on the finite element analysis software. And the influence of the height and radius of the solder joint on the mechanical properties of BGA package structure is analyzed through the stress nephogram of the solder joint array and BGA packaging structure. The results show : the solder joint array has greater stress than other parts when BGA package structure is subjected to random vibration load. And the stress at the corners of the solder joint array is the greatest. In other words, the cracks produced gradually expand inward from the solder joint outer point on the one side of the test plate. And it eventually lead to the solder joint failure. When BGA package structure is subjected to random vibration load, the maximum stress of the solder joint decreases with the increase of radius when other conditions are the same. The maximum stress of the solder joint increases with the increase of height when other conditions are the same.