2001•The proceedings of the JSME annual meetingOpen access

K-0210 Solder Shape Prediction and Optimization of BGA Solder Joint

Hidehisa Sakai, Masaki SHIRATORI, Qiang Yu, Masahide Kaneko

Abstract

In this paper, prediction methods of solder joint shape, such as solder joint height and contact angle, for EGA package, which is effective on high density packaging, are studied. Various calculation methods to predict the melting solder joint shape are studied, and results of the calculation are compared to experimental results to confirm the validity of each calculation methods. Approximate polynomial of solder joint shape, such as solder joint height and contact angle are calculated by combining a numerical differential method and the design of experiment method.

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Key concepts: Soldering, Joint (building), Ball grid array, Materials science, Polynomial, Composite material, Structural engineering, Mathematics