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2010•Electronics & PackagingRequires access

Process Research on Reliability of BGA Solder Joint

Jian Wu

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Abstract

With the development on electronic packaging technology of high density,BGA will be the best choice of high density,high performance,multiple functions and high I/Os.This paper analyzes the critical factors on reliability of BGA solder joint,especially presents critical solutions how to decrease void defect and increase shear strength of solder joint and optimizes process parameters through test.The results show solder void and shear strength of BGA solder joint are apparently improved using optimizing process parameters.After 150℃,1 000h high temperature storage,shear strength of solder joint can meet the requirement of GJB548B-2005.

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What this paper is about

With the development on electronic packaging technology of high density,BGA will be the best choice of high density,high performance,multiple functions and high I/Os.This paper analyzes the critical factors on reliability of BGA solder joint,especially presents critical solutions how to decrease void defect and increase shear strength of solder joint and optimizes process parameters through test.The results show solder void and shear strength of BGA solder joint are apparently improved using optimizing process parameters.After 150℃,1 000h high temperature storage,shear strength of solder joint can meet the requirement of GJB548B-2005.

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Available abstract

With the development on electronic packaging technology of high density,BGA will be the best choice of high density,high performance,multiple functions and high I/Os.This paper analyzes the critical factors on reliability of BGA solder joint,especially presents critical solutions how to decrease void defect and increase shear strength of solder joint and optimizes process parameters through test.The results show solder void and shear strength of BGA solder joint are apparently improved using optimizing process parameters.After 150℃,1 000h high temperature storage,shear strength of solder joint can meet the requirement of GJB548B-2005.

Key concepts: Ball grid array, Soldering, Materials science, Joint (building), Shear strength (soil), Void (composites), Reliability (semiconductor), Direct shear test

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