Zhigang Feng
Abstract
The acceptable criterions,solder defects and reliability of BGA solder joint are discussed.Especially a disputed defect behave, void,will be analyzed in detail.Some suggestions of improving BGA solder joint quality will be also put forward.
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The acceptable criterions,solder defects and reliability of BGA solder joint are discussed.Especially a disputed defect behave, void,will be analyzed in detail.Some suggestions of improving BGA solder joint quality will be also put forward.
Key concepts: Ball grid array, Soldering, Joint (building), Void (composites), Reliability (semiconductor), Materials science, Process (computing), Reliability engineering