2013•Unpublished venueRequires access

Signal Integrity Analysis of BGA Solder Joint

Yuling Shang, Guangyao Shi

Abstract

This paper analyzes Signal Integrity (SI) problems of BGA solder joint, which cannot be ignored in high-speed circuit design. Firstly, full-wave electromagnetic simulation software HFSS is employed to model BGA solder joint. And then, Scattering (S) parameters of BGA solder joint are obtained by simulating the solder joints under different shapes. The return loss of S parameters is analyzed to acquire the effects of BGA solder joint on SI. The results indicate that the influences of the port diameter of solder joint are obvious in the range of the entire simulation frequency, and the impacts of solder height and the maximum outer diameter on SI of solder joint increase rapidly as the frequency rises.

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Available abstract

Key concepts: Soldering, Ball grid array, Joint (building), Materials science, HFSS, Printed circuit board, SIGNAL (programming language), Electronic engineering