2007•China AdhesivesRequires access

Study on the curing kinetics and properties of polyhedral oligomeric silsesquioxane(POSS)/epoxy hybrid resin system

Ji Liu

Abstract

In order to enhance the thermal resistance of epoxy resin,diglycidyl ether of bisphenol A(E51)was modified by polyhedral oligomeric silsesquioxane(POSS)to form organic-inorganic hybrid resin.The curing kinetics of the obtained POSS/E51/DDS hybrid resin system was studied by Ozawa and Kissinger methods,respectively.TGA analysis showed that the incorporation of POSS improved the thermal properties of the E51/DDS system remarkably.

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Key concepts: Silsesquioxane, Diglycidyl ether, Epoxy, Materials science, Curing (chemistry), Bisphenol A, Kinetics, Polymer chemistry