2012•Gōsei jushiRequires access

The Curing Kinetics and Thermal Properties of Epoxy Resin E-51 Modified by Amino Silsesquioxane

Jun Tan

Abstract

Amino silsesquioxane was prepared by the reaction of chloromethyl silsesquioxane(CM-POSS) and ethylenediamine,and it was characterized with infrared spectrum(FT-IR).The curing kinetics of amino silsesquioxane(POSS-NH2)/epoxy resin(E-51)/diaminodiphenl sulfone(DDS) and E-51 system were studied by means of differential scanning calorimetry(DSC),and thermal properties of two systems were researched by TGA.The results indicated that hybrid resin had more activation energy and the thermal properties of the cured hybrid resin were improved with increasing of the content of POSS-NH2.

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Key concepts: Silsesquioxane, Differential scanning calorimetry, Curing (chemistry), Epoxy, Materials science, Kinetics, Polymer chemistry, Ethylenediamine