2009Thermosetting ResinRequires access

Synthesis and characterization of octahydroxyphenyl polyhedral oligemetric silsesquioxane modified epoxy resin

Hao Chen

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Abstract

Octahydroxyphenyl polyhedral oligemetric silsesquioxane(octahydroxyphenyl POSS) was synthesized from octaphenyl POSS by the bromine substitution and addition reaction of grignard reagent and acetone.The structure of the product was characterized by FTIR.Epoxy was modified by the octahydroxyphenyl POSS.The thermal properties of the cured product were investigedg by TGA and DSC.The results showed that the synthesis mothod of POSS with reactive groups was feasible.Adding octahydroxyphenyl POSS had little effect on the thermal stability of cured product,however,the glass transition temperature was increased significantly.The Tg of the system with 5.13wt% octahydroxyphenyl POSS could reach 183.2 ℃

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What this paper is about

Octahydroxyphenyl polyhedral oligemetric silsesquioxane(octahydroxyphenyl POSS) was synthesized from octaphenyl POSS by the bromine substitution and addition reaction of grignard reagent and acetone.The structure of the product was characterized by FTIR.Epoxy was modified by the octahydroxyphenyl POSS.The thermal properties of the cured product were investigedg by TGA and DSC.The results showed that the synthesis mothod of POSS with reactive groups was feasible.Adding octahydroxyphenyl POSS had little effect on the thermal stability of cured product,however,the glass transition temperature was increased significantly.The Tg of the system with 5.13wt% octahydroxyphenyl POSS could reach 183.2 ℃

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Available abstract

Octahydroxyphenyl polyhedral oligemetric silsesquioxane(octahydroxyphenyl POSS) was synthesized from octaphenyl POSS by the bromine substitution and addition reaction of grignard reagent and acetone.The structure of the product was characterized by FTIR.Epoxy was modified by the octahydroxyphenyl POSS.The thermal properties of the cured product were investigedg by TGA and DSC.The results showed that the synthesis mothod of POSS with reactive groups was feasible.Adding octahydroxyphenyl POSS had little effect on the thermal stability of cured product,however,the glass transition temperature was increased significantly.The Tg of the system with 5.13wt% octahydroxyphenyl POSS could reach 183.2 ℃

Key concepts: Silsesquioxane, Materials science, Epoxy, Thermal stability, Acetone, Glass transition, Fourier transform infrared spectroscopy, Reagent

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Synthesis and characterization of octahydroxyphenyl polyhedral oligemetric silsesquioxane modified epoxy resin — Research Paper | ScholarLens