2013•Unpublished venueRequires access

Properties of biphenyl A epoxy resin modified by choromethyl polyhedral silsesquioxane

Tan Ju

Abstract

Hybrid epoxy resin composite materials were prepared from choromethyl polyhedral silsesquioxane(CM-POSS),bisphenol epoxy(E-51),MeTHPA and TEA.The curing reaction of hybrid epoxy,and mechanical and thermal properties of the cured epoxy were characterized by Fourier transform infrared spectroscopy(FT-IR),differential scanning calorimetry(DSC),thermogravimetric analysis(TGA)and heat distortion temperature tester.CM-POSS was connected in cross-linked epoxy resin system by chemical reaction in the curing reaction process.Thermal properties,tensile,bending and impact strengthes of the cured hybrid resin were improved with increased content of CM-POSS.Addition of CMPOSS could make the Tg and rigidity of epoxy resin increase but had little effect on tenacity.

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Key concepts: Epoxy, Silsesquioxane, Thermogravimetric analysis, Heat deflection temperature, Differential scanning calorimetry, Materials science, Curing (chemistry), Composite material