2011Applied Chemical IndustryRequires access

Chemical polishing technology of BFe30-1-1 copper alloy

Hui Zhang

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Abstract

The process of chemical polishing of BFe30-1-1 copper alloy with nitric acid was investigated.The influence of type of brightener,type of corrosion inhibitor,the polishing solution composition and polishing condition including polishing temperature and polishing time on the surface quality of the polished BFe30-1-1 copper alloy was discussed,and processing condition was optimized.The optimum composition of the chemical polishing solution for the BFe30-1-1 copper alloy was 350~450 mL/L sulfuric acid,3~5 mL/L hydrochloric acid,30~40 mL/L nitric acid,2~4 mL/L polyoxyethylene octylphenol ether,and 3 g/L benzotriazole,while the optimized polishing conditions were temperature 30 ℃ and polishing time 3~5 min.

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The process of chemical polishing of BFe30-1-1 copper alloy with nitric acid was investigated.The influence of type of brightener,type of corrosion inhibitor,the polishing solution composition and polishing condition including polishing temperature and polishing time on the surface quality of the polished BFe30-1-1 copper alloy was discussed,and processing condition was optimized.The optimum composition of the chemical polishing solution for the BFe30-1-1 copper alloy was 350~450 mL/L sulfuric acid,3~5 mL/L hydrochloric acid,30~40 mL/L nitric acid,2~4 mL/L polyoxyethylene octylphenol ether,and 3 g/L benzotriazole,while the optimized polishing conditions were temperature 30 ℃ and polishing time 3~5 min.

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Available abstract

The process of chemical polishing of BFe30-1-1 copper alloy with nitric acid was investigated.The influence of type of brightener,type of corrosion inhibitor,the polishing solution composition and polishing condition including polishing temperature and polishing time on the surface quality of the polished BFe30-1-1 copper alloy was discussed,and processing condition was optimized.The optimum composition of the chemical polishing solution for the BFe30-1-1 copper alloy was 350~450 mL/L sulfuric acid,3~5 mL/L hydrochloric acid,30~40 mL/L nitric acid,2~4 mL/L polyoxyethylene octylphenol ether,and 3 g/L benzotriazole,while the optimized polishing conditions were temperature 30 ℃ and polishing time 3~5 min.

Key concepts: Polishing, Benzotriazole, Nitric acid, Copper, Alloy, Hydrochloric acid, Sulfuric acid, Chemical-mechanical planarization

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