2014•Unpublished venueRequires access

The effect of low-melting point alloy re-melting process on the quality of mixed BGA joint and its reliability

Hongqin Wang, Zhonghua Wan, Daojun Luo, Zilian Liu

Abstract

In this paper, a serious crack phenomenon of Backward Compatible Assembled BGA joint with reflow and waving process was found and solved by the optimization of soldering process. The quality of BGA solder joints was confirmed after optimization. The mechanism of such cracking was illustrated.

About this research paper

What this paper is about

Why it matters

A significance statement is not available in the OpenAlex record.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Key concepts: Ball grid array, Soldering, Reliability (semiconductor), Materials science, Joint (building), Cracking, Process (computing), Alloy