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Discussion of welding technology of BGA

Tan Zong-an

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Abstract

With the development of technology,IC was driven in direction to integration,miniaturization,multi-pins and high performance.BGA package form had been widely used in IC process.Therefore,BGA package form had been gotten more and more attention.According to the short circuit,virtual welding,void,splash tin and other phenomena which appear in the reflow of BGA packages was discussed and analyzed in this paper.A total solved scheme to improve to reliability of BGA solder was proposed from the pad design,device protection,solder choice and reflow temperature curve.

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What this paper is about

With the development of technology,IC was driven in direction to integration,miniaturization,multi-pins and high performance.BGA package form had been widely used in IC process.Therefore,BGA package form had been gotten more and more attention.According to the short circuit,virtual welding,void,splash tin and other phenomena which appear in the reflow of BGA packages was discussed and analyzed in this paper.A total solved scheme to improve to reliability of BGA solder was proposed from the pad design,device protection,solder choice and reflow temperature curve.

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Available abstract

With the development of technology,IC was driven in direction to integration,miniaturization,multi-pins and high performance.BGA package form had been widely used in IC process.Therefore,BGA package form had been gotten more and more attention.According to the short circuit,virtual welding,void,splash tin and other phenomena which appear in the reflow of BGA packages was discussed and analyzed in this paper.A total solved scheme to improve to reliability of BGA solder was proposed from the pad design,device protection,solder choice and reflow temperature curve.

Key concepts: Ball grid array, Soldering, Welding, Reliability (semiconductor), Splash, Miniaturization, Materials science, Void (composites)

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