Dynamic recrystallization behavior of Cu-Ni-Si-P alloy

The flow stress behavior of Cu-2.0Ni-0.5Si-0.03P alloy during hot compression deformation was studied by isothermal compression test at Gleeble?1500D thermal-mechanical simulator at the temperature ranging from 600 ℃ to 800 ℃ and at the strain rate from 0.0 1 /s to 5 /s.The results show that the flow stress is controlled by both strain rate and deforming temperature,the flow stress decreases with increasing deforming temperature,while increases with increasing strain rate.When the deformation temperature is 750 and 800 ℃,the flow stress decreases after a peak value,showing continuous dynamic recrystallization.Both the hot deformation activation energy and constitutive equation were derived from the correlativity of flow stress,strain rate and temperature.