Dynamic recrystallization behavior and microstructure evolution of Cu-Ni-Si-P alloy

High temperature compressive experiments of Cu-2.0Ni-0.5Si-0.03P alloy at 0.01-5s-1 and 600-800℃ were performed on Gleeble-1500D thermal-mechanical simulator.The flow stress behavior of the alloy was studied.The results show that the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate.When the deformation temperature is 750℃ and 800℃,the flow stress decreases after a peak value,showing continuous dynamic recrystallization.The flow stress of Cu-2.0Ni-0.5Si-0.03P alloy during high temperature deformation can be represented by a Zener-Hollomon parameter in exponential form.Stress index n,stress scale parameter α,structural factor A,hot deformation activation energy Q,and constitutive equation were derived from the correlativity of flow stress,strain rate and temperature.The microstructures was strongly depended on the deformation temperature.