2010•Advanced materials researchOpen access

Study on Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy

Yi Zhang, Bao Hong Tian, Ping Liu, Shu Guo Jia, Fan Li, Yong Liu

Abstract

The flow stress behavior of Cu-2.0Ni-0.5Si alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator.Dynamic recrystallization and dynamic recovery during high temperature deformation have been investigated by means of compression tests in the temperature and strain rate ranges of 873 to 1073 K and 0.01 to 5s-1 under maxium strain of 60%. The results show the flow stress was controlled by both strain rate and deforming temperature,the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate.The hot deformation equation is e& = e28.47[sinh(0.013s )]5.52 exp(-245.4´103 / RT ) .

About this research paper

What this paper is about

Why it matters

OpenAlex reports 1 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Key concepts: Dynamic recrystallization, Materials science, Flow stress, Isothermal process, Strain rate, Deformation (meteorology), Metallurgy, Alloy