Dynamic recrystallization behavior and microstructure evolution of Cu-Ni-Si-Ag alloy

The flow stress behavior of Cu-2.0Ni-0.5Si-0.15Ag alloy during hot compression deformation was studied by isothermal compression test at a Gleeble-1500D thermal-mechanical simulator at the temperature from 600℃ to 800℃ and at the strain rate from 0.01s~(-1) to 5s~(-1) under maxium strain of 60%.The relationship among the flow stress,strain rates and deformation temperatures was studied.The microstructure of the experimental alloy was studied in the process of hot-compression.The results show that the flow stress is controlled by both strain rate and deforming temperature,the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate.Stress index n,stress scale parameter α,structural factor A,hot deformation activation energy Q,and constitutive equation were derived from the correlativity of flow stress,strain rate and temperature.Microstructure of the alloy strongly depends on deformation temperature.