1993Defense Technical Information Center (DTIC)Requires access

Gallium arsenide dynamic random access memory support circuitry

Michael Andrew Morris

Open publisher page 0 citations

Abstract

This thesis presents the design and layout of a Gallium Arsenide (GaAs) Dynamic Random Access Memory (DRAM array of eight four-bit words including refresh circuitry. In the last several years, there has been significant research investigating the possibilities of producing much faster, lower power and high density DRAM using GaAs. Thus far, this research has yielded success on a limited basis using special materials and fabrication techniques. This design, tested and simulated using HSPICE, supports a memory access time of approximately three nanoseconds, faster than present commercial Static Random Access Memory (SRAM). The logic circuits are designed using GaAs enhancement-mode and depletion-mode (E/ D) metal semiconductor field-effect transistors (MESFETs). Charge storage is facilitated by a single GaAs MESFET connected to a parallel plate capacitor and the required minimum time between refresh is approximately three milliseconds. Power consumption is acceptable and fabrication by Vitesse Semiconductor Corporation using the HGaAs3 process is in progress. The design techniques, power consumption and timing are discussed and demonstrated for the basic logic circuits and the memory array read, write and refresh cycles. A significant increase in DRAM memory bandwidth is gained narrowing the memory bandwidth differential between primary memory and the processor.

About this research paper

What this paper is about

This thesis presents the design and layout of a Gallium Arsenide (GaAs) Dynamic Random Access Memory (DRAM array of eight four-bit words including refresh circuitry. In the last several years, there has been significant research investigating the possibilities of producing much faster, lower power and high density DRAM using GaAs. Thus far, this research has yielded success on a limited basis using special materials and fabrication techniques. This design, tested and simulated using HSPICE, supports a memory access time of approximately three nanoseconds, faster than present commercial Static Random Access Memory (SRAM). The logic circuits are designed using GaAs enhancement-mode and depletion-mode (E/ D) metal semiconductor field-effect transistors (MESFETs). Charge storage is facilitated by a single GaAs MESFET connected to a parallel plate capacitor and the required minimum time between refresh is approximately three milliseconds. Power consumption is acceptable and fabrication by Vitesse Semiconductor Corporation using the HGaAs3 process is in progress. The design techniques, power consumption and timing are discussed and demonstrated for the basic logic circuits and the memory array read, write and refresh cycles. A significant increase in DRAM memory bandwidth is gained narrowing the memory bandwidth differential between primary memory and the processor.

Why it matters

A significance statement is not available in the OpenAlex record.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

This thesis presents the design and layout of a Gallium Arsenide (GaAs) Dynamic Random Access Memory (DRAM array of eight four-bit words including refresh circuitry. In the last several years, there has been significant research investigating the possibilities of producing much faster, lower power and high density DRAM using GaAs. Thus far, this research has yielded success on a limited basis using special materials and fabrication techniques. This design, tested and simulated using HSPICE, supports a memory access time of approximately three nanoseconds, faster than present commercial Static Random Access Memory (SRAM). The logic circuits are designed using GaAs enhancement-mode and depletion-mode (E/ D) metal semiconductor field-effect transistors (MESFETs). Charge storage is facilitated by a single GaAs MESFET connected to a parallel plate capacitor and the required minimum time between refresh is approximately three milliseconds. Power consumption is acceptable and fabrication by Vitesse Semiconductor Corporation using the HGaAs3 process is in progress. The design techniques, power consumption and timing are discussed and demonstrated for the basic logic circuits and the memory array read, write and refresh cycles. A significant increase in DRAM memory bandwidth is gained narrowing the memory bandwidth differential between primary memory and the processor.

Key concepts: Dynamic random-access memory, Semiconductor memory, Memory refresh, Static random-access memory, Sense amplifier, Computer science, MESFET, Dram

Related papers

Back to paper searchBrowse research topicsOriginal source
Gallium arsenide dynamic random access memory support circuitry — Research Paper | ScholarLens