2002•Unpublished venueRequires access

A new passive CMOS telemetry chip to receive power and transmit data for a wide range of sensor applications

D. Dudenbostel, Karl-Ludwig Krieger, C. Candler, R. Laur

Open publisher page 24 citations

Abstract

A new full integrated telemetry chip with the possibility of integrated micro coils on the chip is presented. The telemetry chip receives the power for the sensor microsystem. Using a passive modulation technique the telemetry chip transmits measured data to the external power transmitter. In order to verify the performance of the telemetry chip, the transfer channel between the external transmitter and the receiver with the circuits of the telemetry chip have been simulated with SPICE. Measurements of a produced telemetry chip were made to confirm our technical concept and they verify the full operation of our telemetry chip.

About this research paper

What this paper is about

A new full integrated telemetry chip with the possibility of integrated micro coils on the chip is presented. The telemetry chip receives the power for the sensor microsystem. Using a passive modulation technique the telemetry chip transmits measured data to the external power transmitter. In order to verify the performance of the telemetry chip, the transfer channel between the external transmitter and the receiver with the circuits of the telemetry chip have been simulated with SPICE. Measurements of a produced telemetry chip were made to confirm our technical concept and they verify the full operation of our telemetry chip.

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OpenAlex reports 24 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

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Method / approach

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Available abstract

A new full integrated telemetry chip with the possibility of integrated micro coils on the chip is presented. The telemetry chip receives the power for the sensor microsystem. Using a passive modulation technique the telemetry chip transmits measured data to the external power transmitter. In order to verify the performance of the telemetry chip, the transfer channel between the external transmitter and the receiver with the circuits of the telemetry chip have been simulated with SPICE. Measurements of a produced telemetry chip were made to confirm our technical concept and they verify the full operation of our telemetry chip.

Key concepts: Telemetry, Chip, Transmitter, CMOS, Electrical engineering, Chipset, System on a chip, Electronic engineering

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