Design and fabrication of a GaAs/Al0.4Ga0.6As micro-accelerometer based on piezoresistive effect
Guowen Liu, Binzhen Zhang, Kairui Zhang
Abstract
Open-access reader
Guowen Liu, Binzhen Zhang, Kairui Zhang
Abstract
Open-access reader
In this paper, a novel piezoresistive accelerometer based on the piezoresistive effect of GaAs/Al 0.4 Ga 0.6 As thin films was designed. The piezoresistive accelerometer contains four suspended flexural beams and a central proof mass configuration. The piezoresistive effect of a piezoresistor or thin film was used to make a resistor changing the output that is proportional to applied acceleration. The GaAs-based piezoresistive accelerometer was prepared with advanced surface micromachining processes, and bulk micromachining processes. Finally, the static pressure experiments were conducted on the sensing element. The experimental results showed that the combined semiconductor heterostructures and mechanical cantilevers have a good stress sensitive characteristic. The integration of these technologies promises to bring about a revolution in the applications of the semiconductor fine-structure devices.
OpenAlex reports 1 citations for this work. Citation counts describe recorded attention and do not establish research quality.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
In this paper, a novel piezoresistive accelerometer based on the piezoresistive effect of GaAs/Al 0.4 Ga 0.6 As thin films was designed. The piezoresistive accelerometer contains four suspended flexural beams and a central proof mass configuration. The piezoresistive effect of a piezoresistor or thin film was used to make a resistor changing the output that is proportional to applied acceleration. The GaAs-based piezoresistive accelerometer was prepared with advanced surface micromachining processes, and bulk micromachining processes. Finally, the static pressure experiments were conducted on the sensing element. The experimental results showed that the combined semiconductor heterostructures and mechanical cantilevers have a good stress sensitive characteristic. The integration of these technologies promises to bring about a revolution in the applications of the semiconductor fine-structure devices.
Key concepts: Piezoresistive effect, Accelerometer, Materials science, Cantilever, Resistor, Optoelectronics, Surface micromachining, Bulk micromachining