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Silicon Micromachining

Masayoshi Esashi

Open publisher page 230 citations

Abstract

Advanced micro sensors for pressure, angular rate, ultrasonic imaging and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep RIE, isotropic XeF2 silicon etching performs precise micromachining. Par(alle1 electrode structures enable capacitive sensing and electrostatic actuation for force balancing servo and resonance. 2. Pressure sensor and resonant gyro fabricated using deep RIE and XeF2 etching.

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What this paper is about

Advanced micro sensors for pressure, angular rate, ultrasonic imaging and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep RIE, isotropic XeF2 silicon etching performs precise micromachining. Par(alle1 electrode structures enable capacitive sensing and electrostatic actuation for force balancing servo and resonance. 2. Pressure sensor and resonant gyro fabricated using deep RIE and XeF2 etching.

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Available abstract

Advanced micro sensors for pressure, angular rate, ultrasonic imaging and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep RIE, isotropic XeF2 silicon etching performs precise micromachining. Par(alle1 electrode structures enable capacitive sensing and electrostatic actuation for force balancing servo and resonance. 2. Pressure sensor and resonant gyro fabricated using deep RIE and XeF2 etching.

Key concepts: Surface micromachining, Bulk micromachining, Deep reactive-ion etching, Materials science, Silicon, Etching (microfabrication), Microelectromechanical systems, Capacitive sensing

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