2003Unpublished venueRequires access

A fully-packaged silicon micromachined piezoresistive accelerometer

Kevin Walsh, H. Thurman Henderson, Gregory N. De Brabander

Open publisher page 5 citations

Abstract

The design and development of a second-generation miniature piezoresistive micromachined accelerometer are presented. Bulk micromachining etching techniques were utilized in the fabrication of the single-crystalline silicon device. The sensor is essentially its own package, consisting of three carefully aligned

About this research paper

What this paper is about

The design and development of a second-generation miniature piezoresistive micromachined accelerometer are presented. Bulk micromachining etching techniques were utilized in the fabrication of the single-crystalline silicon device. The sensor is essentially its own package, consisting of three carefully aligned

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OpenAlex reports 5 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

The design and development of a second-generation miniature piezoresistive micromachined accelerometer are presented. Bulk micromachining etching techniques were utilized in the fabrication of the single-crystalline silicon device. The sensor is essentially its own package, consisting of three carefully aligned

Key concepts: Piezoresistive effect, Surface micromachining, Bulk micromachining, Accelerometer, Etching (microfabrication), Fabrication, Microelectromechanical systems, Silicon

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