2013•Microelectronics ReliabilityRequires access

Random vibration reliability of BGA lead-free solder joint

Fang Liu, Guang Meng

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Key concepts: Ball grid array, Soldering, Random vibration, Materials science, Vibration, Joint (building), Structural engineering, Printed circuit board

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Random vibration reliability of BGA lead-free solder joint — Research Paper | ScholarLens