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Reliability of BGA Packages for Highly Reliable Application and Chip Scale Package Board Level Reliability

Reza Ghaffarian

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Abstract

Diffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.

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Diffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.

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Available abstract

Diffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.

Key concepts: Ball grid array, Surface-mount technology, Chip-scale package, Reliability (semiconductor), Chip, Aerospace, Reliability engineering, Quad Flat No-leads package

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