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CSP, BGA, and SM Packages for Harsh Environmental Applications

Reza Ghaffarian

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Abstract

Different aspects of advanced surface mount package technology have been investigated for aerospace applications.

About this research paper

What this paper is about

Different aspects of advanced surface mount package technology have been investigated for aerospace applications.

Why it matters

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Available abstract

Different aspects of advanced surface mount package technology have been investigated for aerospace applications.

Key concepts: Ball grid array, Computer science, Environmental science, Business, Reliability engineering, Engineering, Materials science, Soldering

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