Reza Ghaffarian
Abstract
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
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Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Key concepts: Ball grid array, Surface-mount technology, Mount, Reliability (semiconductor), Aerospace, Chip-scale package, Chip, Ball (mathematics)