Chip Scale Package Joint Integrity of CSP under Isothermal Aging
Reza Ghaffarian
Abstract
Reza Ghaffarian
Abstract
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
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The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
Key concepts: Joint (building), Chip-scale package, Scale (ratio), Chip, Isothermal process, Reliability engineering, Computer science, Embedded system