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Chip Scale Package Joint Integrity of CSP under Isothermal Aging

Reza Ghaffarian

Open publisher page 2 citations

Abstract

The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.

About this research paper

What this paper is about

The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.

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OpenAlex reports 2 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.

Key concepts: Joint (building), Chip-scale package, Scale (ratio), Chip, Isothermal process, Reliability engineering, Computer science, Embedded system

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