Reza Ghaffarian
Abstract
Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
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Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
Key concepts: Reliability (semiconductor), Reliability engineering, Computer science, Engineering, Physics, Quantum mechanics, Power (physics)