2002•The proceedings of the JSME annual meetingOpen access

Reliability Evaluation of Solder Joints in Chip Scale Packages (CSPs) for Portable Equipment

Kouta NAGANO, Akihiro YAGUCHI, Munehiro Yamada, Masanori SHIBAMOTO

Abstract

To determine the lifetime of solder joints in chip scale packages we conducted cyclic-bending, heat-cycle, and impact-bending tests. We used Sn-3Ag-0.5Cu solder and Sn-37Pb solder for the evaluation. The cyclic-bending and the heat-cycle tests showed that the lifetime of Sn-3Ag-0.5Cu solder joint was approximately twice that of Sn-37Pb solder joint. On the other hand, in the impact-bending test, the lifetime of Sn-3Ag-0.5Cu joint was shorter than that of Sn-37Pb solder joint due to interfacial crack growth.

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Key concepts: Soldering, Joint (building), Bending, Materials science, Reliability (semiconductor), Chip-scale package, Solder paste, Structural engineering