Low - Temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion

In this paper, the atomic diffusion bonding (ADB) is adopted for silicon dies and glass wafer using. In order to improve the bonding quality, the bonding of glass wafer and silicon dies has been achieved through Au-Au atomic-diffusion bonding. To reduce the surface roughness, copper is deposited on the glass surface to meet the bonding requirements. At the same time, in order to achieve mass production and reduce bonding porosity, an innovative method: die to wafer bonding is proposed, which is also of great help to improve bonding quality.