2017•Extended Abstracts of the 2017 International Conference on Solid State Devices and MaterialsRequires access

Cross Point Type 1T-1MTJ STT-MRAM Cell with 60 nm Multi-pillar Vertical Body Channel MOSFET under 55 nm p-MTJ and Its Beyond for High Density STT-MRAM

Takayoshi Sasaki, T. Endoh

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Abstract

2017 International Conference on Solid State Devices and Materials,Cross Point Type 1T-1MTJ STT-MRAM Cell with 60 nm Multi-pillar Vertical Body Channel MOSFET under 55 nm p-MTJ and Its Beyond for High Density STT-MRAM

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2017 International Conference on Solid State Devices and Materials,Cross Point Type 1T-1MTJ STT-MRAM Cell with 60 nm Multi-pillar Vertical Body Channel MOSFET under 55 nm p-MTJ and Its Beyond for High Density STT-MRAM

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Available abstract

2017 International Conference on Solid State Devices and Materials,Cross Point Type 1T-1MTJ STT-MRAM Cell with 60 nm Multi-pillar Vertical Body Channel MOSFET under 55 nm p-MTJ and Its Beyond for High Density STT-MRAM

Key concepts: Magnetoresistive random-access memory, Materials science, Pillar, MOSFET, Optoelectronics, Channel (broadcasting), Electrical engineering, Random access memory

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Cross Point Type 1T-1MTJ STT-MRAM Cell with 60 nm Multi-pillar Vertical Body Channel MOSFET under 55 nm p-MTJ and Its Beyond for High Density STT-MRAM — Research Paper | ScholarLens