2003•Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuuOpen access

Study on Influence of the Design Factors on the Reliability of BGA Solder Joints

Qiang Yu, Jae Chul JIN, Hirokazu Abe, Masaki SHIRATORI

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Key concepts: Ball grid array, Soldering, Reliability (semiconductor), Reliability engineering, Materials science, Structural engineering, Forensic engineering, Composite material

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Study on Influence of the Design Factors on the Reliability of BGA Solder Joints — Research Paper | ScholarLens