2006•Microelectronics ReliabilityRequires access

Analysis of Cu/low-k bond pad delamination by using a novel failure index

M.A.J. van Gils, O. van der Sluis, G.Q. Zhang, J.H.J. Janssen, R.M.J. Voncken

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Key concepts: Bumping, Wafer dicing, Delamination (geology), Materials science, Molding (decorative), Reliability (semiconductor), Cracking, Composite material