Deposition of thin films at higher substrate temperatures in atmospheric pressure glow discharge

The atmospheric pressure glow discharge was used for the deposition of thin organosilicon polymer films. The plasma was burning in pure nitrogen used as a carrier gas and a small admixture of organosilicons compounds such as hexamethyldisilazane (HMDSN) or hexamethyldisiloxane (HMDSO) was used as a monomer. The temperature of the substrate was elevated up to 120 degrees of Celsia to obtain harder thin films. The homogeneity of thin films was enhanced using movable upper electrode. Electrical measurements were used to distinguish between glow and filamentary regime. Mechanical properties of deposited films were characterised by depth sensing indentation technique. The films were polymer-like, transparent in visible range, with uniform thickness and without pinholes.