2005•Semiconductor TechnologyRequires access

Quality Control of BGA Solder Joint

Xian Fei

Abstract

BGA is a new concept of contemporary assembly technology. BGA has developed andinnovated the SMT/SMD since it appeared. It is believed that BGA will be the best choice for the IC withdensity, high performance, multiple function and high I/O. The acceptable criterions, solder defects andreliability of BGA solder joint are discussed. Especially a disputed defect behave, void is analyzed. Somesuggestions of improving BGA solder joint quality are also put forward.

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Available abstract

Key concepts: Ball grid array, Soldering, Joint (building), Void (composites), Materials science, Metallurgy, Engineering, Structural engineering