Investigation of a novel thermoelectric cooling device

A novel thermoelectric cooling device with a liquid cooling system was developed and assembled for sub-ambient temperature cooling of chips in over-clocking or super calculating testing system was set up and experiments were conducted to investigate the refrigeration performances of device in various application conditions. Results showed that the maximum heat dissipating capacity was 7W/cm2 when case temperature was the same as ambient temperature,operating voltage of TEC was 48 V and the cooling air flowrate was 3—5m/s. TEC was conducive to heat dissipation especially in high ambient temperature(35℃). The case temperature of the heat source was reduced by 5.4℃ at the input heat flux of 23.78W/cm2,operating voltage of TEC 16— 48 V, and cooling air flowrate of5m/s. In addition,the liquid cooling system was beneficial to coefficient of performance(COP) of TEC.The maximum COP and heat flux were 3.5 and 15W/cm2 respectively at the case temperature was 10℃higher than ambient temperature, operating voltage of TEC 4 — 48 V and the cooling air flowrate of3—5m/s.