Study on Electroless Copper Plating on Graphite Particles Surfce
Cheen Jin-chao
Abstract
Cheen Jin-chao
Abstract
In order to make most of advantage of electric conductivity of copper and self-lubricate wear-resistant properties of graphite and improve the wetting state between the graphite particle powder and copper metal, graphite particle powder were coated successfully by electroless copper plating method, with emphasis on the influence of electroless components and processing parameters on the thickness, deposition rate of coated copper plating layer, from which achieving optimizing electrolesscopper components and processing parameters, It has been found by X-ray diffraction, electronic microscopy ,TEM that there was a interface between graphite and copper with zigzag microstructure, bonding interface of mechanical and metallurgical is very obvious. The bonding force between the platings and the substrates as well as the main source of the bonding force greatly depend on coarsing processing of pretreatment of graphite powder.
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In order to make most of advantage of electric conductivity of copper and self-lubricate wear-resistant properties of graphite and improve the wetting state between the graphite particle powder and copper metal, graphite particle powder were coated successfully by electroless copper plating method, with emphasis on the influence of electroless components and processing parameters on the thickness, deposition rate of coated copper plating layer, from which achieving optimizing electrolesscopper components and processing parameters, It has been found by X-ray diffraction, electronic microscopy ,TEM that there was a interface between graphite and copper with zigzag microstructure, bonding interface of mechanical and metallurgical is very obvious. The bonding force between the platings and the substrates as well as the main source of the bonding force greatly depend on coarsing processing of pretreatment of graphite powder.
Key concepts: Materials science, Graphite, Copper, Metallurgy, Copper plating, Microstructure, Wetting, Plating (geology)