2002•Materials for Mechanical EngineeringRequires access

Electroless Copper Plating on Graphite Powder Surface

Gui Wang

Abstract

In order to solve the interface problem in Cu/C pantograph slide manufacture and improve the comprehensive properties of the slide graphite powders were coated by the method of electroless copper plating. The results showed that, through the optimizing process, the average thickness of copper coating reached 7.1μm and the wetting quantity of copper/graphite interface was improved. In this paper, the pretreat process and the influence of the main salt, reductant, temperature and loading capacity on plating process were discussed.

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Key concepts: Materials science, Graphite, Copper, Wetting, Metallurgy, Coating, Plating (geology), Copper plating