LI Shu-cai
Abstract
The epoxy adhesive was introduced in terms of main properties and features.The research present state,the existing problems and the development trends of the heat-resistant epoxy adhesive cured at room temperature were also reviewed with 26 refs.
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The epoxy adhesive was introduced in terms of main properties and features.The research present state,the existing problems and the development trends of the heat-resistant epoxy adhesive cured at room temperature were also reviewed with 26 refs.
Key concepts: Epoxy, Adhesive, Materials science, Epoxy adhesive, Composite material, High heat, Layer (electronics)