Xu Zhang
Abstract
In this paper, a kind of tougheness adhesive with heatresistance is introduced. The adhesive obtained high strength, after cured at room temperature for one day. The adhesive could be used at 200℃ for long period and be used at 250℃ for short period, and it can be used for the bonding to many kinds of materials.
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In this paper, a kind of tougheness adhesive with heatresistance is introduced. The adhesive obtained high strength, after cured at room temperature for one day. The adhesive could be used at 200℃ for long period and be used at 250℃ for short period, and it can be used for the bonding to many kinds of materials.
Key concepts: Materials science, Adhesive, Composite material, Epoxy, Heat resistance, Epoxy adhesive, Water resistance, Layer (electronics)