Study on High and Low Temperature Resistant Epoxy Adhesive Cured at Room Temperature
Jianhua Li
Abstract
Jianhua Li
Abstract
A high and low temperature resistant epoxy adhesive which can be cured at room temperature is developed. The E-51 and 711 epoxy resin with lower viscosity is used as the matrix resin. When the 20%(wt) toughening agent is added to the system, the comprehensive properties of ad-hesive is improved, and it has good high and low temperature resistance. The adhesive can be mostly cured after 24h at room temperature. It shows good performance in experiments of medium-resistance and hygrothermal ageing resistance. The adhesive can be used as adhesive and encapsulant for its low viscosity.
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A high and low temperature resistant epoxy adhesive which can be cured at room temperature is developed. The E-51 and 711 epoxy resin with lower viscosity is used as the matrix resin. When the 20%(wt) toughening agent is added to the system, the comprehensive properties of ad-hesive is improved, and it has good high and low temperature resistance. The adhesive can be mostly cured after 24h at room temperature. It shows good performance in experiments of medium-resistance and hygrothermal ageing resistance. The adhesive can be used as adhesive and encapsulant for its low viscosity.
Key concepts: Adhesive, Materials science, Epoxy, Composite material, Viscosity, Epoxy adhesive, Toughening, Toughness