2006•Fudan xuebao. Ziran Kexue banRequires access

Analysis about Shear Strength of Sn-Ag-Cu and Sn-Ag-Bi Solder on Ni-P Board

Fei Xiao

Abstract

The shear sthrength of Sn-Ag-Cu and Sn-Ag-Bi lead-free solder joints on Ni-P board are tested after aging up to 1 000 h by an improved shear test method.Moreover,the microstructures of the facture surface are studied.The results indicate that the shear strength of solder joint and fracture location are related to the morphology and composition of the intermetallic compound(IMC).With the increase of IMC thickness,the fracture location approaches gradually to the interface between IMC and the board.The shear strength of Sn-Ag-Bi solder joint is much higher than that of Sn-Ag-Cu,while the fracture failure in brittle IMC layer is more easily to occur for Sn-Ag-Bi solder joint.

About this research paper

What this paper is about

Why it matters

A significance statement is not available in the OpenAlex record.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Key concepts: Intermetallic, Soldering, Materials science, Shear strength (soil), Direct shear test, Joint (building), Microstructure, Shear (geology)