2018•Journal of Materials Science Materials in ElectronicsRequires access

Interfacial behavior and joint strength of Sn–Bi solder with solid solution compositions

Fengjiang Wang, Hong Chen, Ying Huang, Chao Yan

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Key concepts: Soldering, Materials science, Intermetallic, Shear strength (soil), Isothermal process, Composite material, Metallurgy, Joint (building)

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Interfacial behavior and joint strength of Sn–Bi solder with solid solution compositions — Research Paper | ScholarLens