2006•Electronic Components and MaterialsRequires access

Study on Shear Strength for Sn-3Ag-3Bi Solder Joint

Fei Xiao

Abstract

A new shear test method was proposed, by which the testing errors were effectively suppressed. With the new test method, Sn-3Ag-3Bi lead-free solder joints on Cu and Ni-P board for aging up to 1 000 hours were tested respectively. Moreover, the microstructures of solder joints facture surface were studied. The data showed that shear strength and fracture location of joints are related to the composition and thickness of the intermetallic compound (IMC) at the interface between solder and board materials.

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Key concepts: Soldering, Intermetallic, Materials science, Joint (building), Direct shear test, Shear strength (soil), Microstructure, Shear (geology)