2002•Medical Entomology and ZoologyRequires access

Joint reliability evaluation methods of a BGA solder ball terminal

Kiyoshi Sekinaga, Koichi Matushita, Hiroshi Matushima, Tetsuaki Wada

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Key concepts: Ball grid array, Reliability (semiconductor), Reliability engineering, Joint (building), Soldering, Terminal (telecommunication), Ball (mathematics), Computer science

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Joint reliability evaluation methods of a BGA solder ball terminal — Research Paper | ScholarLens