Researches on electroless Ni-P plating on glass substrate

Glass substrate with amorphous electroless Ni-P deposit can be used as disk board of computer. To solve the general problems of cracking and peering appeared on the Ni-P deposits, the effects of surface properties of glass, structure of the Ni-P deposits and their phosphorus content, toughness, internal stress and adhesion of the deposits on the cracking of Ni-P deposit were investigated. By adjusting composition of plating solution, optimizing temperature, pH value of plating solution and plating time. A formula of Ni-P electroless plating process for glass substrate was obtained.