2004Materials for Mechanical EngineeringRequires access

Process of Electroless Ni-Cu-P Plating on Engineering Plastics

Zhijun Zheng

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Abstract

The bath composition and plating conditions of electroless Ni-Cu-P deposits on engineering plastics were studied based on electroless Ni-P plating.The experiment results show that nickel and copper can be co-deposited and good Ni-Cu-P coating can be achieved when the content of the complexing agent is above two times that of the nickel salt.The effects of the structure and composition of the deposits on the electrical resistivity and adhesion of the deposits were discussed.

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The bath composition and plating conditions of electroless Ni-Cu-P deposits on engineering plastics were studied based on electroless Ni-P plating.The experiment results show that nickel and copper can be co-deposited and good Ni-Cu-P coating can be achieved when the content of the complexing agent is above two times that of the nickel salt.The effects of the structure and composition of the deposits on the electrical resistivity and adhesion of the deposits were discussed.

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Available abstract

The bath composition and plating conditions of electroless Ni-Cu-P deposits on engineering plastics were studied based on electroless Ni-P plating.The experiment results show that nickel and copper can be co-deposited and good Ni-Cu-P coating can be achieved when the content of the complexing agent is above two times that of the nickel salt.The effects of the structure and composition of the deposits on the electrical resistivity and adhesion of the deposits were discussed.

Key concepts: Materials science, Metallurgy, Plating (geology), Nickel, Electroless plating, Copper, Electrical resistivity and conductivity, Coating

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